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DS Smith Leads Packaging Innovation with Installation of First Highcon Beam 3

DS Smith Leads Packaging Innovation with Installation of First Highcon Beam 3

DS Smith Leads Packaging Innovation with Installation of First Highcon Beam 3 Groundbreaking digital die cutting system installed at DS Smith Packaging France

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“DS Smith is glad to start a new partnership with Highcon; innovation is in DS Smith’s DNA” said Armand Chaigne, Managing Director – France & Spain Consumer, DS Smith Packaging Division. “The implementation of the laser-cut machine Beam 3 in one of our French sites is exciting. This project supports the growing demand for sustainable packaging solutions and allows DS Smith to continue delighting our customers.”

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